By Ho-Ming Tong,Yi-Shao Lai,C.P. Wong
Advanced turn Chip Packaging offers prior, current and destiny advances and traits in components comparable to substrate know-how, fabric improvement, and meeting tactics. turn chip packaging is now in common use in computing, communications, patron and automobile electronics, and the call for for turn chip know-how is continuous to develop to be able to meet the necessity for items that supply greater functionality, are smaller, and are environmentally sustainable.
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Extra resources for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong