Ho-Ming Tong,Yi-Shao Lai,C.P. Wong's Advanced Flip Chip Packaging PDF

By Ho-Ming Tong,Yi-Shao Lai,C.P. Wong

ISBN-10: 1441957677

ISBN-13: 9781441957672

ISBN-10: 1489979336

ISBN-13: 9781489979339

Advanced turn Chip Packaging offers prior, current and destiny advances and traits in components comparable to substrate know-how, fabric improvement, and meeting tactics. turn chip packaging is now in common use in computing, communications, patron and automobile electronics, and the call for for turn chip know-how is continuous to develop to be able to meet the necessity for items that supply greater functionality, are smaller, and are environmentally sustainable.

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Advanced Flip Chip Packaging by Ho-Ming Tong,Yi-Shao Lai,C.P. Wong


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